MiJing CH5-E Intelligent Mainboard Layered Welding Platform for iPhone 12/12Mini/12Pro/12ProMax

Features:

1：Intellectually manufactured in the industry Double heating element improves heating efficiency and saves your time
2：Layered desoldering and lamination integration complete welding in 3 minutes
3：Multiple functions are integrated
Support CPU, hard disk IC, baseband IC removal
4：Laminated board design effectively solves the problem of bent board bonding
It can also correct the bent plate

Product name:

Mijing motherboard layered bonding desoldering station CH5-D
Suitable for motherboard:
Phone 12/ Phone12 Pro
Product Features;
Motherboard delamination, desoldering, bonding, etc.
Product material:
High temperature resistant synthetic stone, non-slip silicone

Product Color: Rice King Blue Matte Grey
Product size: 165*95 *45 mm
Heating core: dual heating core
Voltage: 110V / 220V