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Mijing Z21 MAX Universal CPU Reballing Stencil Platform For iPhone A8-A16 Android Phone IC Chip Planting Tin Template Fixture - PFPCBHR066
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Mijing Z21 MAX Universal CPU Reballing Stencil Platform For iPhone A8-A16 Android Phone IC Chip Planting Tin Template Fixture

Mijing Z21 MAX Universal CPU Reballing Stencil Platform For iPhone A8-A16 Android Phone IC Chip Planting Tin Template Fixture
Mijing Z21 MAX Universal CPU Reballing Stencil Platform For iPhone A8-A16 Android Phone IC Chip Planting Tin Template Fixture
Mijing Z21 MAX Universal CPU Reballing Stencil Platform For iPhone A8-A16 Android Phone IC Chip Planting Tin Template Fixture
Mijing Z21 MAX Universal CPU Reballing Stencil Platform For iPhone A8-A16 Android Phone IC Chip Planting Tin Template Fixture
Mijing Z21 MAX Universal CPU Reballing Stencil Platform For iPhone A8-A16 Android Phone IC Chip Planting Tin Template Fixture
Mijing Z21 MAX Universal CPU Reballing Stencil Platform For iPhone A8-A16 Android Phone IC Chip Planting Tin Template Fixture
Mijing Z21 MAX Universal CPU Reballing Stencil Platform For iPhone A8-A16 Android Phone IC Chip Planting Tin Template Fixture
  • Availability: In Stock
  • Product Code: PFPCBHR066
$17.98

Available Options

Mijing Z21 MAX Universal CPU Reballing Stencil Platform For iPhone A8-A16 Android Phone IC Chip Planting Tin Template Fixture

Choose: 

For iPhone: it will comes one Z21 Max station and A8-A16 (9pcs) Steel Meshes

For Android: it will comes one Z21 Max station and 12pcs steel meshes 

12pcs steel meshes includes:

  • Huawei HI3670, HI3680,
  • HiSilicon HI3690, HI3690 5G, HI6290/L
  • Qualcomm SM8250-102 Small, SM8250-202 Big, 
  • QualcommSM8350/Snapdragon888
  • Snapdragon 845/SDM845, 855/SM8150, 
  • Kirin 9000 HI36A0
  • Emmc/Emcp/Ufs BAG153 

For iPhone and Android: It will comes one Z21 Max station and 21pcs steel meshes



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