IC Chip Repair Thin Blade Tool CPU Remover Burin To Remove iPhone Processors NAND Flash From Mainboard For BGA Product

10 In 1 Metal IC Chip Repair Tools Toughness Thin Blade Tool CPU Remover Burin To Remove For iPhone Repair Maintenance

Features:
With heat resistance, low temperature, anti-oxidation, corrosion resistance, abrasion resistance, toughness.

Specifications:
Quench: 780 ℃~820 ℃(Cold water)
Starting temperature: 1000 ℃~1050 ℃
Termination temperature: 850℃
Quench temperature: 730℃~760℃(water, water and oil  or Alkali bath cooling)
Quench hardness: 57HRC
Temper temperature: 160℃~180℃
Product size: approx. 132*10*10mm/5.19*0.39*0.39''
Net weight: approx. 40g
Gross weight: approx. 47g

Note:
Due to different producing batches, product details might be a little different. If you minding the difference, please buy it carefully.
Please allow 1-3mm differs due to manual measurement. 

Package include:

1 x Metal Remover Tool
10 x Metal Slice